EMI/EMC/RFI Shielding Products / Bake & Peel Conductive Masking

Applying Conductive Masking Tape

A 5-Step Guide for Bake & Peel Application

Bake & Peel Easy Peel Masking Tape for solving oxidation issues.

  1. Surface Preparation – Make sure the area is clean and dry before applying the Bake & Peel. Use Methyl Ethyl Ketone or anything comparable to clean any tainted surfaces.
  2. Apple Bake & Peel on the Surface – When the Bake & Peel tape is in place, apply moderate pressure with a rubber roller to ensure proper adherence to the surface. Before handling or processing, allow it to stand at room temperature for at least one hour (but ideally 24-hours).
  3. Smooth over surfaces and paint – Making sure the Bake & Peel tape is also covered, paint or powder coat the surface as usual.
  4. Bake the Equipment – At a temperature between 220°C and 350°C for 5 to 60 minutes.
  5. Remove conductive masking tape – as soon as the painted area has reached room temperature, remove the Bake & Peel tape. (This will make it simple to remove the “Easy Peel” middle strip and lower the chance that the paint may chip when it is being taken off.)

Note: To lessen the chance that the foil will also be removed off the surface, it is crucial to peel back the mask at an angle that is as near to 180° as feasible.

Custom Grades including MilSpec, Def STAN, NSN, AS & DTD available. Below is a sample of common grades. Contact us for your unique requirements.