Foil and Masking Shielding Tapesblockquote>Conductive foil tapes for EMI/ RFI and ESD grounding applications
EMI are pleased to be able to offer a wide range of conductive foil tapes designed specifically for EMI/RFI, ESD and Grounding applications. We have further developed these basic foil tapes into a range of conductive masking products including tapes and gaskets which we call “Bake and Peel”.
The standard range of foil tapes are all coated with F2525 Silver filled acrylic adhesive which has extremely low electrical resistance and are as follows:-
F384 - High tensile Copper foil, readily accepts solder.
F385 - Tin Clad Copper foil, readily accepts solder, corrosion resistant.
F386 - High tensile Aluminium foil, high conformability for complex and intricate applications.
F577 - High tensile copper foil, which readily accepts solder and uses a Carbon adhesive for low a low cost solution.
This product is available in the following materials:
• Foil and Masking Shielding Tapes.